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Moment

A Packaging House Tests the AI Chip Chain

2026年11月10日 1 分钟阅读

Xinde priced at the bottom of its range and listed in Hong Kong, a rare public read on advanced packaging.

Xinde Semiconductor, ticker 07672, began trading on the Hong Kong Stock Exchange main board on 10 November 2026, pricing its offer at HK$8.88 per share at the bottom of its range. The deal sold 106.5 million shares and raised about HK$882 million net, with the Hong Kong tranche roughly 9.8 times subscribed and a one-lot success rate of 80%. The company is loss-making on growing revenue and holds about 0.6% of China’s outsourced packaging and test market, a segment that constrains AI chip output.

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